Saras Micro Devices is a fully funded start-up company developing innovative power delivery solutions enabling further advancements and market adoption of high-performance computing, AI, virtual reality, 5G and more.
Saras is developing this pioneering technology in partnership with industry-leading Fortune 500 companies and other innovative computing solution providers to support best-in-class, energy-efficient products. Our vision is to change the performance-to-power paradigm for next generation computing solutions through heterogeneously integrated Saras Micro Devices products.
We look forward to talking with smart, energetic, team-oriented professionals who can grow with us. We provide competitive salary and benefit plans, and some of the best co-workers you’ll find anywhere.
Our Values are:
- Sense of Mission
- Teamwork
- Accountability
- Recognition
- Diversity & Inclusion
- Respect
Please review the opportunity below and we look forward to getting to know you!!
Essential Duties:
- Companywide owner and administrator of the Saras Gates Initiative
- Support Operations with the Saras Gates Exit reviews
- Develop strong partnership with Business Development and R&D teams to be in compliance with the Saras Gates Deliverables
- Support Engineering Teams with the Process Qualifications (IQ/OQ/PQ) design
- Owns the Companywide Capacity Model design and checkpoints
- Assist Operations and Engineering with the ramp to manufacturing volumes to demonstrate the technology meets requirements while simultaneously transferring the technology to counterparts in manufacturing
- Assist with the Cost Model analysis – hand to hand with Finance
- Assist Facilities and EHS departments on the future expansion projects – Lay out and CapEx information integration.
- Partnership with Quality Department to build the Saras Operating System within the ISO9001:2015 Quality Standard guidelines and matching with the Saras Gates deliverables.
- Prepare reports for weekly/monthly KPI reporting in Ops, Staff and All-Hands Meetings.
Key Competencies:
- Five+ years of experience in the Semiconductors Industry
- BS in chemical, Electrical, Mechanical or Industrial Engineering, MS degree is a plus
- NPI (New Product Introduction) / Product Development experience a plus
- Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, material, component & system level reliability, testing, FA and device/package-system integration
- Familiar in advanced device/packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints
- Excellent problem solving with strong physics and fundamentals
- Excellent verbal, written and presentation skills and capability to promote new ideas
- Excellent communication skills that enable the candidate to work well with internal cross functional teams (BD, R&D, Engineering and C-suit)
- Basic knowledge of signal integrity/power integrity (Familiar)
- Familiar with ISO 9001:2015 Quality Systems Standard
- Team oriented personality who can also work independently.
- Good analytical skills, root cause analysis skills, time management skills, be self-motivated and self-directing and ability to proceed with minimal direction and information
- Proactive at executing daily tasks and achieving OKR goals
- Ability to travel domestically as needed.
Equipment/Software Experience:
- MS Office – Project Planner, Intermediate to Expert level (Excell and Power Point mainly)
- AutoCAD a plus
- ERP/MES a Plus
- JMP, Minitab or any statistical package a plus