Sr. Specialist, Manufacturing Engineering

Job Title: Sr. Specialist, Manufacturing Engineering
Job Code: 16596
Job Location: Cincinnati, OH
Job Schedule: 4/10; Monday - Thursday, 7:00 AM - 5:00 PM
Job Description:
This position supports strategic programs essential to maintaining U.S. Armed Forces' readiness. This job would be part of the Automated Electronics manufacturing department, which is responsible for all circuit card assembly operations, including both automated processes (selective solder, depanel, in-circuit testing, functional testing, cleaning, conformal coating, etc.) and manual processes (labeling, hand soldering, wiring, adhesives, mechanical assembly, press-fit installation, etc.). The successful Manufacturing Engineer will contribute as a member of production support team. Manufacturing Engineers also support production through operator training, process issue resolution, and monitoring and evaluating existing operations for opportunities to improve efficiency, first pass yield, and scrap rates.
Primary responsibilities:

• Support established production programs and new product introduction as a process owner and subject matter expert
• Maintain J-STD-001 certification and/or IPC-A-610 certification
• Interface with customers and present status and projects to management

Process owner duties:

• Capital equipment selection, procurement, validation, and installation
• Participate in design for manufacturability reviews
• Develop calibration and maintenance requirements
• Design and validation of tooling and fixturing
• Create and execute operator training programs
• Create and maintain work instructions
• Support quoting and proposals
• Monitor and optimize process performance thru data analysis
• Investigate root cause and implement permanent corrective actions for any process non-conformances
• Troubleshoot and analyze manufacturing production problems related to materials, product design, tooling, and equipment

Process owner responsible for some ( not all ) of the following processes:

• SMT assembly (screen print, SPI, pick and place, AOI, reflow, conveyors)
• Selective Solder and THT component installation/soldering
• J-STD-001/IPC-A-610 inspection
• Hand soldering, touch up, rework
• BGA rework and x-ray inspection
• Inline and Batch cleaning
• Depanel
• Flying probe and/or bed of nails in-circuit testing
• Automated conformal coat application, curing, masking, touch up and inspection
• Adhesive application and curing (staking, underfilling, bonding, encapsulation, etc.)
• Press-fit installation of hardware, connectors, etc.
• Labeling, 2D barcodes, UID
• Other circuit card assembly processes

Qualifications:

• Bachelor's Degree and minimum 6 years of prior relevant experience. Graduate Degree and a minimum of 4 years of prior related experience. In lieu of a degree, minimum of 10 years of prior related experience.
• Requires strong knowledge of job area. Typically viewed as having a specialty within discipline.
• Broad knowledge of project management.

Preferred Additional Skills:

• J-STD-001 and/or IPC-A-610 certification
• ISO9001 / AS9100 experience
• Knowledge and understanding of engineering drawings and root cause analysis
• Familiarity with geometric dimensioning and tolerancing
• Experience leading continuous improvement projects in a manufacturing environment
• Good communication, technical writing, and technical presentation skills
• Advanced computer skills to support multiple electronic interfaces and software platforms