- Full-time
- Job Type (exemption status): Exempt position - Please see related compensation & benefits details below
- Salary Range: 121,975.00-172,800.00
- Business Function: Packaging Engineering
Company Description
At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.
At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology.
We are a key partner to some of the largest and highest growth organizations in the world, energizing competitive gaming platforms, enabling safer cities and smarter cars, and powering data centers behind many of the world’s biggest companies.
We offer an expansive portfolio of technologies, storage devices, and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital, G-Technology, SanDisk, and WD brands.
Job Description
As a Packaging Engineer, you will work in the Packaging R&D group on modeling and simulation, design of experiment, and testing across semiconductor packaging, flash memory product, and host levels.
ESSENTIAL DUTIES AND RESPONSIBILITIES:
- Influence package and product design by addressing structural integrity and reliability issues, and advancing semiconductor packaging technology.
- Model and simulate mechanical responses of IC packages and flash products, including solid-state drives.
- Interface with package & product design, electrical and physical characterization, reliability testing, failure analysis, assembly R&D, and other process teams.
- Solid background in applied mechanics, especially computational and/or experimental solid mechanics, is required.
Qualifications
REQUIRED:
- Ph.D. in Mechanical Engineering plus >3 years, or M.S. in Mechanical Engineering plus >5 years of relevant industrial experience.
- Knowledge in mechanical engineering of IC packaging and related areas.
- Strong background in computational solid mechanics and/or experimental solid mechanics.
- Broad knowledge of mechanical behaviors of various material types, including composite laminates, polymers, and metals.
- Working knowledge in designing and conducting mechanical testing and/or using a commercial FEA package.
- Understanding of semiconductor packaging processes, materials, technology, and trends.
SKILLS:
- Strong oral and written communication skills.
- Demonstrated strong work ethic.
- Ability to work in a global team environment and interact with other engineers.
Additional Information
Western Digital is committed to providing equal opportunities to all applicants and employees and will not discriminate based on their race, color, ancestry, religion, sex, gender, age, national origin, sexual orientation, medical condition, marital status, physical disability, mental disability, or other legally protected characteristics.
Western Digital thrives on the power and potential of diversity, believing that the fusion of various perspectives results in the best outcomes for our employees and customers.
Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at to advise us of your accommodation request.
Compensation & Benefits Details
- An employee’s pay position within the salary range may be based on several factors including relevant education, qualifications, certifications, experience, and business needs.
- The salary range is applicable for jobs performed in California, Colorado, New York, or remote jobs that can be performed in those states.
- You will be eligible to participate in Western Digital’s Short-Term Incentive (STI) Plan and may be eligible for our annual Long-Term Incentive (LTI) program.
- We offer a comprehensive package of benefits including paid vacation time, medical/dental/vision insurance, and more.