Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
In the role of a Technical Package Product Manager & Member of Technical Staff at Micron, you will be at the forefront of innovation in memory package development. Your expertise will be crucial in developing the next generations of low power product solutions for the world’s leading providers of handheld and mobile solutions. Join us!
Your responsibilities include collaborating with customers on their package product requirements and solutions; defining test vehicles to deliver the vital sophisticated package design rules, new materials and integrations; and providing consultation on package design, thermal, electrical, mechanical, reliability, and cost considerations.
You will work with a diverse multi-functional team in Micron. Your role will contribute to the alignment between product market development, die and package design, and chip to package interactions, ensuring they are seamlessly coordinated with assembly, testing, manufacturing, and global quality standards. This role offers the outstanding opportunity to engage with senior executives in crafting the development of ground breaking packaging technologies.
Responsibilities include, but are not limited to:
- Engaging customers in systems requirements for end application and translating into package product technical requirement's definition (thermal, mechanical, reliability and aspects of electrical).
- Defining memory package design rule roadmap for wirebond stacked memory applications. Including rules to achieve reliability requirements, Chip-Package-Interaction (CPI), substrate design, die stacking and materials.
- Leading a winning team for test vehicle design and execution to achieve roadmap requirements and validation ahead of go-to-market product timelines.
- Leading a multi-functional design and development team to achieve revenue package products on schedule by influencing design attributes, materials selection, die fit studies, cost analysis and reliability requirements.
- Collaborating with Business, Product Engineering and field teams to guide package products from concept to mass production.
Required Experience:
- Degree in Physics, Materials Science, Mechanical Engineering, Chemical Engineering, or Electrical Engineering; advanced degrees (MS, PhD) are preferred.
- A minimum of 10 years of experience in related field.
- Documented record of technical expertise and innovation resulting in high impact results; publications, patents; and track record of technical leadership and mentoring.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn more about Micron, please visit micron.com/careers
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