Silicon Photonics Packaging Engineer

Company:  Women Impact Tech
Location: San Francisco
Closing Date: 05/11/2024
Hours: Full Time
Type: Permanent
Job Requirements / Description
RESPONSIBILITIES:
  • Design microelectronic assembly processes for automotive-grade receiver and transmitter packages / modules from wafer fab to package integration
  • Define specifications for custom IC package designs and chip carriers to meet product and qualification requirements. Work with external partners to realize those parts
  • Plan and execute process optimization and characterization, design validation, failure analysis, and sample builds for package development and automotive qualification
  • Lead yield analysis and drive improvement/corrective actions for silicon process and microelectronic assembly
  • Collaborate with external manufacturing partners to develop new packaging processes and prototypes to meet IC and system specifications.
  • Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM), and low-volume order placement of diverse components such as substrates, epoxies, coated glass, PCBAs, and tooling.
  • Drive mass production readiness with multiple engineering and operation teams
BASIC QUALIFICATIONS:
  • 5+ years in Semiconductor Package/Process Development or 2+ years with a relevant masters degree.
  • Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substrates
  • Experience in wafer level processing (dielectric thin film deposition, RIE silicon processing, wafer-to-wafer bonding, spin coat/lift-off processing, wafer dice and test)
  • Experience in automated micro electronic and photonic assembly processes (wafer inspection, high accuracy epoxy/solder die attach, wire bonding, vision inspection, glob top/underfill dispense)
  • Working knowledge of Failure Analysis tools such as X-ray, 3D interferometry, DIC microscopy, SEM, cross-section, destructive testing, etc.
  • Understanding of CMOS image sensor sensor architecture and operation is preferred
BONUS QUALIFICATIONS:
  • Bachelor's and/or Master's degree in Electrical or Mechanical Engineering
  • Experience with optical systems
  • Experience with ATE package test environment
  • Experience with statistical analysis for volume production processes
  • AEC-Q100 or related automotive qualification experience
Apply Now
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