Sr Principal Engineer RF Microwave Design

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems sector delivers a decisive advantage to its customers through software-defined, hardware-enabled solutions. Northrop Grumman Mission Systems (NGMS) in Linthicum enables these hardware solutions by providing RF microwave and mixed signal architecture, design, verification, and support expertise across a wide variety electronic sensor products. Our engineers work on complex, leading edge, high reliability electronics supporting maritime, ground, airborne, and space platforms.

AMS E&S is seeking engineers with experience and interest in electronic assembly and packaging design including:

1. Designing, modeling, and verifying RF, microwave, and mixed signal subsystem assemblies
2. Utilize analysis, simulations and prototyping to develop antenna designs including phased arrays
3. Deriving and trading requirements with subsystem engineers and component level designers
4. Managing RF budgets, frequency planning, and common assembly level interfaces
5. Predicting assembly level performance through selecting materials, components, and packaging approaches, RF chain analysis, electromagnetic simulation, data collection and analysis, and other modeling techniques
6. Working directly with component level design peers developing custom RF integrated circuit designs to meet assembly-level requirements
7. Collaborating with peer functions such as Mechanical, Manufacturing, Quality, Supply Chain, and Test
8. Utilizing world class manufacturing capabilities both on-site and within the broader company for prototyping through full rate production from the foundry level to microelectronic packaging to printed circuit board fabrication and assembly to subsystem level integration and test
9. Working directly with a wide variety of different external supplier partners including leading domestic foundries, printed circuit board fabricators and assemblers, component manufacturers, material fabricators, and more
10. Supporting products throughout the product life cycle

T04 Basic Qualifications

1. Electrical Engineering or related STEM field degree: Bachelor of Science with 9 years of RF/microwave experience; Master's degree with 7 years of RF/microwave experience; PhD degree with 4 years of experience
2. Ability to develop solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty which require the regular use of ingenuity and creativity
3. Established subject matter expertise in one or more areas of RF/Microwave discipline including but not limited to: RF components & assemblies, requirements development, EM and related modeling & simulation, RF test verification, production test support, and design for producibility
4. Exhibit expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (i.e. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)
5. US Citizenship is required
6. Ability to obtain and maintain a DoD Security Clearance
7. Proven knowledge of electrical engineering design software and equipment
8. Effective verbal and written communication skills
9. Ability to design, implement, install and maintain electrical systems
10. Technical Team Leadership

Preferred Qualifications

1. Secret or Top Secret / SCI security clearance
2. RF and mixed signal printed circuit board and circuit card assembly level design
3. RF budgeting, frequency planning, RF chain analysis and modeling, schematic capture, electromagnetic simulation, signal integrity analysis
4. Component selection and/or custom component requirements flow down and trades
5. Ceramic and organic printed circuit board materials, design, fabrication, and assembly processes
6. Integrated Circuit packaging techniques including chip-and-wire, QFN, flip-chip
7. RF lab equipment such as network analyzers, spectrum analyzers, signal generators, power meters, etc.
8. Electronic troubleshooting from component to assembly levels
9. Complex data reduction and analysis
10. Product life cycle support from concept through production support
11. Designing for high reliability, mil/aero requirements and environments
12. AESA / phased array, Radar, SIGINT, or SATCOM experience
13. Technical team leadership
14. Experience in the Aerospace or Defense Industry
15. Software tools: Mentor Xpedition DX Designer, ANSYS HFSS, Keysight ADS, Keysight Genisys, MathWorks MATLAB, Autodesk AutoCAD, and Microsoft Office Suite (Excel, PowerPoint, Project, Word)

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit . U.S. Citizenship is required for most positions.